通信技術(shù)公司產(chǎn)品說明資料翻譯-中英對照

發(fā)行編號2.0，  　 　 　 　 　
參考  　 　 　 　 　 　 　 　 　 　 　 　 　
(1 "電氣和電子設(shè)備"的定義中關(guān)于通信技術(shù)有限公司物質(zhì)清單的限定：  　 　           
-"電氣和電子設(shè)備"指的是依靠電流或者電磁場進(jìn)行工作的設(shè)備            
以及在設(shè)計使用的額定電壓不超過1 000伏特(交流電)和1 500伏特(直流電)的條件下，進(jìn)行發(fā)電、傳輸和測量這些電流和磁場            
的設(shè)備。           
1.大型家用電器            
2.小型家用電器            
3.IT 和通信設(shè)備，例如：集中式數(shù)據(jù)處理；主機；小型計算機；筆記本計算機；記事本計算機；            
使用電子方式進(jìn)行信息收集、貯存、處理、顯示或者傳播的其它產(chǎn)品和設(shè)備；用戶終端和系統(tǒng)；            
手提式移動電話；通過通信方式傳送聲音、圖像或者其它信息的答疑系統(tǒng)和其它產(chǎn)品或設(shè)備；            
4.用電設(shè)備：例如：為記錄或者復(fù)制聲音或者圖像的產(chǎn)品或者設(shè)備，包括通過通信進(jìn)行比對聲音和圖像分配            
的信號或者其它技術(shù)。            
5. 照明設(shè)備           
6.電氣和電子工具(除大型固定的工業(yè)設(shè)備)，例如：鉚接工具、釘接工具或螺紋工具或鉚釘清除工具、            
釘子、螺絲或類似用途；焊接工具、錫焊或類似用途            
7.玩具、休閑和運動設(shè)備,例如: 便攜式電子游戲機; 電子游戲機; 騎車、潛水、跑步、劃船計算機等等; 帶有電氣或電子設(shè)備的            
運動設(shè)備。           
8.醫(yī)學(xué)設(shè)備(全部用于移植和感染性設(shè)備除外)            
9.監(jiān)控和控制儀器            
10.自動發(fā)送系統(tǒng)            
注： 電池不包括在"電氣和電子設(shè)備"的定義內(nèi)            
　 　  　           
(2涂層中鎘含量的禁用細(xì)則：            
-如果涂層中鋅含量較高，鎘的殘余量必須盡可能減小到最少，無論如何不得超過0.1 %。            
　 　 　 　           
(3包裝材料中鎘、六價鉻、鉛和水銀含量的禁用細(xì)則：            
-包裝材料或者包裝組成部分的中鎘、六價鉻、鉛和水銀含量總重量不得超過包裝重量的0.01%。            
　 　 　 　           
(4塑料穩(wěn)定劑鉛含量的禁令豁免：            
-除非另有通知，適用于接入產(chǎn)品內(nèi)的電纜(不包括用戶接入的電纜薄膜)            
-注當(dāng)塑料為該產(chǎn)品的一部分時，"電氣和電子設(shè)備"允許的最大含量限制也可以采用這些豁免標(biāo)準(zhǔn)。            
　 　 　 　           
(5電氣和電子設(shè)備里的鉛含量的禁令豁免：            
-陰極射線管、電子器件和日光燈玻璃中的鉛含量；            
-鋼材中合金元素的鉛含量的重量不超過總重量的0.35%，鋁材料中鉛含量的重量不超過總重量的0.4%，            
銅合金中的鉛含量的重量不超過總重量的4%            
-高融化溫度類型焊料的鉛含量(如：鉛基合金中鉛含量的重量為百分之85或更多)            
-電子陶器零件中的鉛含量( 例如壓電設(shè)備)            
-柔性銷釘連接器系統(tǒng)中的鉛含量            
-熱傳導(dǎo)模件c形環(huán)涂料中的鉛含量            
-在銷釘和微處理器包裝之間使用超過兩種元素組成的焊料中的            
鉛含量的重量大于總重量的百分之80，并少于百分之85； 　           
-集成電路的倒扣封裝中半導(dǎo)體模具和載體之間不同的電氣裝線所使用焊料的鉛含量，；           
-鉛青銅軸承殼套和管襯中的鉛含量            
-富鉛玻璃中的鉛含量符合附件1中歐共體理事會指令69/493 / (類別1，2，3 和4)的要求            
-離連接裝置0.65毫米或鎳鐵帶鉛框架更少距離的小模數(shù)零部件面漆的鉛含量           
-離連接裝置0.65毫米或鎳鐵帶銅框架更少距離的小模數(shù)零部件面漆的鉛含量           
-光纖通信系統(tǒng)的法拉第轉(zhuǎn)子裝置(稀土鐵石榴子石)里雜質(zhì)的鉛含量。            
-進(jìn)行孔洞的盤狀和平面陣列陶瓷多層電容器焊接焊料的鉛含量。            
　 　 　 　           
(6電氣和電子設(shè)備里的水銀禁令的豁免：            
-每個小型熒光燈內(nèi)的水銀含量不超過5毫克            
-常用直管熒光燈里的水銀含量不超過           
　 -鹵化磷酸10毫克  　           
　 -正常周期使用的三磷酸鹽5毫克            
　 -長期使用的三磷酸鹽8毫克            
-專用直管熒光燈的水銀含量            
-豁免指令目錄里沒有提及的其它燈具里的水銀含量。            
　 　 　 　           
(7使用中的特別問題如下：            
-不得使用在包裝材料中。在事先沒有通過諾基亞西門子通信技術(shù)有限公司的同意，不得在印刷線路板清漆或者其它可能加熱到分解溫度的操作            
或產(chǎn)品的修理過程中使用；            
　 　 　 　           
(8"均質(zhì)材料"是指不能機械拆分成不同的材料的材料。            
-"均質(zhì)"的理解是"完全一致的結(jié)構(gòu)"。 "均質(zhì)材料"的示例為塑料制品、陶器制品、玻璃、金屬、合金、            
紙板、板材、樹脂和涂層個體。 例如一個不銹鋼螺絲是一種"均質(zhì)材料"，但是半導(dǎo)體封裝包含許多均質(zhì)材料，            
包括塑料成型材料、鉛框架的鍍錫層、鉛框架合金和金鍵導(dǎo)線。            
-"機械分離"是指材料可以原則上采用機械行為進(jìn)行分離，例如擰、切、壓、磨和磨損處理。            
　 　 　 　           
(9諾基亞西門子通信技術(shù)有限公司物質(zhì)清單中的"特意引入"的定義：            
-"特意引入"是指"有意識的利用在一種材料或者組成部件的配制，在需要其繼續(xù)存在的最終產(chǎn)品內(nèi)提供            
一種具體的特性、外形或質(zhì)量"。使用的可回收材料可以作為新產(chǎn)品的原料，不認(rèn)定為特意引入，對于可回收材料的某些部分            
可以包含一定數(shù)量的限用物質(zhì)。            
　 　 　 　           
(10使用壬基苯酚和壬基苯酚乙氧基化物禁令的豁免：            
允許在：  　 　           
-清洗液體進(jìn)行再循環(huán)或灰化處的控制關(guān)閉洗干燥系統(tǒng)，清洗液體進(jìn)行再循環(huán)或灰化處的特殊處理清洗系統(tǒng)；            
-凡是在生物廢水進(jìn)行廢水處理前，經(jīng)過預(yù)處理，并全部去除有機餾份的紡織品和皮革可以不進(jìn)入            
廢水或系統(tǒng)中進(jìn)行特別處理；            
-在清洗液體進(jìn)行再循環(huán)或灰化處的閉合系統(tǒng)使用金屬部件；            
　 　 　 　           
(11鉛和鎘使用的禁令豁免：            
-光學(xué)和過濾器玻璃里的鉛和鎘含量            
　 　 　 　           
(12電氣和電子設(shè)備里的鎘和鎘化合物含量的禁令豁免：            
-除操作禁令外，電觸點和鎘鍍層的鎘和鎘化合物必須符合關(guān)于危險物品和備制的銷售和使用限制            
歐共體91/338 /指令和歐共體76/769 /修訂指令，           
　 　 　 　           
(13有關(guān)暴露下，對腫瘤、突變劑和再生毒素造成的影響如下：            
-和皮膚接觸的物質(zhì)的位置都是有固態(tài)產(chǎn)品表面層包裹。            
-易揮發(fā)物質(zhì)在購買之后仍然為固態(tài)產(chǎn)品。            
-除非在可交替最大含量標(biāo)準(zhǔn)的"表面材料的最大含量"欄目中的"命名組物質(zhì)"規(guī)定可以超過0.1%，            
危害性物質(zhì)在產(chǎn)品中的標(biāo)準(zhǔn)為0.1%，           
　 　 　 　           
(14全氟辛烷磺化物的禁令豁免：  　 　 　 　 　 　 　 　 　
-允許使用光阻材料或者減反射膜的光刻處理技術(shù)，非裝飾性硬鉻鍍層(VI)的霧抑制劑  　 　 　
和控制電鍍系統(tǒng)的濕潤劑，將釋放到環(huán)境的全氟辛基磺酸類化學(xué)物質(zhì)的數(shù)量減到最小。  
NOKIA SIEMENS NETWORKS SUBSTANCE LIST, Issue 2.0, June 20, 2008 　 　 　 　 　
References 　 　 　 　 　 　 　 　 　 　 　 　 　
(1 Definition of "electric and electronic equipment" for the restrictions in the Nokia Siemens Networks Substance List: 　 　           
- "Electrical and electronic equipment" means equipment which is dependent on electric currents or electromagnetic fields in order to work properly and equipment           
  for the generation, transfer and measurement of such currents and fields falling under the categories below and designed for use with a voltage rating not exceeding            
 1 000 volts for alternating current and 1 500 volts for direct current;           
1. Large household appliances           
2. Small household appliances           
3. IT and telecommunications equipment, such as: Centralized data processing ; Mainframes; Minicomputers; Notebook computers; Notepad computers;            
Other products and equipment for the collection, storage, processing, presentation or communication of information by electronic means; User terminals and systems;           
Cellular telephones; Answering systems and other products or equipment of transmitting sound, images or other information by telecommunications           
4. Consumer equipment, such as: Products or equipment for the purpose of recording or reproducing sound or images, including signals or other technologies            
for the distribution of sound and image than by telecommunications           
5. Lighting equipment           
6. Electrical and electronic tools (with the exception of large-scale stationary industrial tools), such as: Tools for riveting, nailing or screwing or removing rivets,            
nails, screws or similar uses;  Tools for welding, soldering or similar use            
7. Toys, leisure and sports equipment, such as: Hand-held video game consoles; Video games; Computers for biking, diving, running, rowing, etc. ; Sports equipment            
with electrical or electronic components           
8. Medical devices (with the exception of all implanted and infected products)           
9. Monitoring and control instruments           
10. Automatic dispensers            
NOTE: Batteries are not included in the definition of "electrical and electronic equipment"           
　 　  　           
(2  Details of the ban of cadmium in paints:           
- If the paints have a high zinc content, their residual concentration of cadmium must be as low as possible and at all events not exceed 0.1 % by mass.           
　 　 　 　           
(3  Details of the ban of cadmium, hexavalent chromium, lead and mercury in packaging:           
- The sum of concentration levels of cadmium, hexavalent chromium, lead and mercury in packaging or packaging components shall not exceed 0.01% by weight.           
　 　 　 　           
(4  Exemptions to the ban of lead as a plastic stabilizer:           
- Use in electrical cables incorporated into products (excluding consumer accessible cable sheetings) allowed until further notice           
- Note: The maximum allowable concentration limits for "electrical and electronic equipment" shall be applied also to these exemptions when the plastic material is a part of such product.           
　 　 　 　           
(5  Exemptions to the ban of lead in electrical and electronic equipment:           
- Lead in glass of cathode ray tubes, electronic components and fluorescent tubes           
- Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminium containing up to 0.4%  lead by weight            
  and as a copper alloy containing up to 4% lead by weight           
- Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)           
- Lead in electronic ceramic parts (e.g. piezoelectronic devices)           
- Lead used in compliant pin connector systems           
- Lead as a coating material for the thermal conduction module c-ring           
- Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 %            
  and less than 85 % by weight 　           
- Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages           
- Lead in lead-bronze bearing shells and bushes           
- Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC           
- Lead in finishes of fine pitch components others than connectors with a pitch of 0.65 mm or less with NiFe lead-frames            
- Lead in finishes of fine pitch components others than connectors with a pitch of 0.65 mm or less with copper lead-frames            
- Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems.           
- Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.           
　 　 　 　           
(6  Exemptions to the ban of mercury in electrical and electronic equipment:           
- Mercury in compact fluorescent lamps not exceeding 5 mg per lamp           
- Mercury in straight fluorescent lamps for general purposes not exceeding           
　 - halophosphate 10 mg 　           
　 - triphosphate with normal lifetime 5 mg           
　 - triphosphate with long lifetime 8 mg           
- Mercury in straight fluorescent lamps for special purposes           
- Mercury in other lamps not specifically mentioned in the list of exemptions to the directive.           
　 　 　 　           
(7 Applications in question are in particular the following:           
- Not to be used in packaging materials. Not to be used without prior Nokia Siemens Networks consent in PWB varnishes or other applications where it may be heated to decomposition           
  temperatures in use or in repair of products           
　 　 　 　           
(8 "Homogeneous Material" means a material that can not be mechanically disjointed into different materials.              
- The term "homogeneous" is understood as "of uniform composition throughout". Examples of "homogeneous materials" are individual types of plastics, ceramics, glass, metals, alloys,            
  paper, board, resins and coatings. For example a stainless steel screw is a "homogeneous material", but a semi-conductor package contains many homogeneous materials which           
  include plastic moulding material, tin-platings on the lead-frame, the lead-frame alloy and gold-bonding wires.           
- The term "mechanically disjointed" means that the material can be, in principle separated by mechanical actions such as unscrewing, cutting, crushing, grinding and abrasive processes.           
　 　 　 　           
(9 Definition of "Intentionally introduced" for the purpose of the Nokia Siemens Networks Substance List :           
- "Intentionally introduced" shall mean "deliberately utilised in the formulation of a material or component where its continued presence is desired in the final product to provide            
  a specific characteristic, appearance or quality". The use of recycled materials as feedstock for the manufacture of new products, where some portion of the recycled materials            
  may contain amounts of regulated substances, is not to be considered as intentionally introduced.           
　 　 　 　           
(10 Exemptions for the ban of using Nonylphenols and Nonylphenol ethoxylates:           
Allowed in:   　 　           
- controlled closed dry cleaning systems where the washing liquid is recycled or incinerated, cleaning systems with special treatment where the washing liquid is recycled or incinerated;           
- textiles and leather processing with no release into waste water and systems with special treatment where the process water is pretreated to remove the organic fraction completely           
  prior to biological waste water treatment;            
- metal working uses in controlled closed systems where the washing liquid is recycled or incinerated;            
　 　 　 　           
(11 Exemptions for the ban of using lead and cadmium:           
- Lead and cadmium in optical and filter glass           
　 　 　 　           
(12 Exemptions to the ban of cadmium and its compounds in electrical and electronic equipment:           
- Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC           
  relating to restrictions on the marketing and use of certain dangerous substances and preparations           
　 　 　 　           
(13 Exposures considered significant for carcinogens, mutagens, and reproductive toxins are the following:           
- Where significant levels of the substance may come into contact with the skin as a result of leaching from the solid product surface.           
- Where a volatile substance is still present within the solid product following purchase.           
- The substance is considered to be at significant levels when it is present in the product at levels at or above 0.1% unless an alternate maximum concentration level is provided in the             
  "Maximum Concentration Limit in surface materials" column of the "Substances in Named Groups" worksheet.           
　 　 　 　           
(14 Exemptions to the ban of perfluorooctane sulfonates: 　 　 　 　 　 　 　 　 　
- Use allowed as photoresists or anti-reflective coatings for photolithography processes, mist suppressants for non-decorative hard chromium (VI) 　 　 　
  plating and wetting agents for use in controlled electroplating systems where the amount of PFOS released into the environment is minimized 　 　 　
              
武漢翻譯公司

2012.11.1